Presentation 1995/12/15
Thermal Deformation Analysis of Printed Circuit Board and Connector Due to Current Flow by Using Holographic Pattern Measuring System (HPMS)
Masanari TANIGUCHI, Tasuku TAKAGI,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The authors' have developed a new measuring system (Holographic Pattern Measuring System: HPMS) which is composed of both techniques of holographic interferometry and graphic image processing. In this study, the HPMS was applied to thermal deformation analysis of printed circuit board (PCB) and connector due to current flow. As the results, the microscopic displacement level of PCB and connector due to current flow can be evaluated quantitatively, and the deformation pattern could be clearly obtained as a 3-D graphic image. And, taking into account of the thermal stress conditions due to current flow to connector were made clear.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Printed circuit board / Connector / Thermal deformation / Holography / Pattern measurement
Paper # EMD95-51
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Conference Information
Committee EMD
Conference Date 1995/12/15(1days)
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Paper Information
Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Thermal Deformation Analysis of Printed Circuit Board and Connector Due to Current Flow by Using Holographic Pattern Measuring System (HPMS)
Sub Title (in English)
Keyword(1) Printed circuit board
Keyword(2) Connector
Keyword(3) Thermal deformation
Keyword(4) Holography
Keyword(5) Pattern measurement
1st Author's Name Masanari TANIGUCHI
1st Author's Affiliation Meijo University()
2nd Author's Name Tasuku TAKAGI
2nd Author's Affiliation Nihon University
Date 1995/12/15
Paper # EMD95-51
Volume (vol) vol.95
Number (no) 439
Page pp.pp.-
#Pages 6
Date of Issue