Presentation | 1995/12/15 Thermal Deformation Analysis of Printed Circuit Board and Connector Due to Current Flow by Using Holographic Pattern Measuring System (HPMS) Masanari TANIGUCHI, Tasuku TAKAGI, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | The authors' have developed a new measuring system (Holographic Pattern Measuring System: HPMS) which is composed of both techniques of holographic interferometry and graphic image processing. In this study, the HPMS was applied to thermal deformation analysis of printed circuit board (PCB) and connector due to current flow. As the results, the microscopic displacement level of PCB and connector due to current flow can be evaluated quantitatively, and the deformation pattern could be clearly obtained as a 3-D graphic image. And, taking into account of the thermal stress conditions due to current flow to connector were made clear. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Printed circuit board / Connector / Thermal deformation / Holography / Pattern measurement |
Paper # | EMD95-51 |
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Committee | EMD |
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Conference Date | 1995/12/15(1days) |
Place (in Japanese) | (See Japanese page) |
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Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Electromechanical Devices (EMD) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Thermal Deformation Analysis of Printed Circuit Board and Connector Due to Current Flow by Using Holographic Pattern Measuring System (HPMS) |
Sub Title (in English) | |
Keyword(1) | Printed circuit board |
Keyword(2) | Connector |
Keyword(3) | Thermal deformation |
Keyword(4) | Holography |
Keyword(5) | Pattern measurement |
1st Author's Name | Masanari TANIGUCHI |
1st Author's Affiliation | Meijo University() |
2nd Author's Name | Tasuku TAKAGI |
2nd Author's Affiliation | Nihon University |
Date | 1995/12/15 |
Paper # | EMD95-51 |
Volume (vol) | vol.95 |
Number (no) | 439 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |