| Presentation | 1995/11/17 Water Proof Characteristic of Miniature Connector for FA Sensors : Mold-bonding Characteristics of Materials for Connectors Satoshi KURAMOTO, Hisakazu YAMADA, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Responding to demands for downsizing and water proof characteristics in FA fields, a φ8 miniature FA connector is developed. In the structure, junctions among different materials such as cable, housing and over mold should be sealed to keep water proof characteristics. As the downsizing has advanced, it has become difficult to keep sealing at these junctions among different materials in conventional technology including method to spread a adhesive. In this connector, a mold-bonding technology was established, which welds and integrates junctions among a housing and a cable inserted on a cavity die when over mold is molded. As a result, it reduced the volume ratio to 1/4 in comparison with conventional products and maintained waterproof performance as well. This paper will concentrate on mold-bonding characteristics among housing cable and some elastomers selected as a material for over mold. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | connector / waterproof / elastomers / bonding / material / FA field |
| Paper # | EMD95-45 |
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| Conference Information | |
| Committee | EMD |
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| Conference Date | 1995/11/17(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Paper Information | |
| Registration To | Electromechanical Devices (EMD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Water Proof Characteristic of Miniature Connector for FA Sensors : Mold-bonding Characteristics of Materials for Connectors |
| Sub Title (in English) | |
| Keyword(1) | connector |
| Keyword(2) | waterproof |
| Keyword(3) | elastomers |
| Keyword(4) | bonding |
| Keyword(5) | material |
| Keyword(6) | FA field |
| 1st Author's Name | Satoshi KURAMOTO |
| 1st Author's Affiliation | OMRON Coryoration, Kyoto Laboratory() |
| 2nd Author's Name | Hisakazu YAMADA |
| 2nd Author's Affiliation | OMRON Coryoration, Kyoto Laboratory |
| Date | 1995/11/17 |
| Paper # | EMD95-45 |
| Volume (vol) | vol.95 |
| Number (no) | 370 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |