Presentation 1996/11/15
A Study of Terminal Construction on Surface Mounted Relay
Mitsuhiro KAWAI, Tatsurou ISHIKAWA,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) Recently, not only electronics components but mechanical one also has tendency of surface mounting. Up to the present, surface mounted relays were developed by reforming the terminal shape from through hole type to surface mount. Therefore, the terminal was poorly heated by reflow soldering process, because the terminal positioned behind the relay. We develop the new terminal construction that design is specialized for surface mount parts. The characteristics of this design is that the terminal is led outside from the middle of the side surface. This terminal design is easy to raise the temperature of the terminal on reflow soldering process, the terminal in not behind the relay. And this terminal design can make the terminal length long.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) surface mounted / terminal construction / relay / soldering
Paper # EMD96-73
Date of Issue

Conference Information
Committee EMD
Conference Date 1996/11/15(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Study of Terminal Construction on Surface Mounted Relay
Sub Title (in English)
Keyword(1) surface mounted
Keyword(2) terminal construction
Keyword(3) relay
Keyword(4) soldering
1st Author's Name Mitsuhiro KAWAI
1st Author's Affiliation OMRON Corporation Control components development division()
2nd Author's Name Tatsurou ISHIKAWA
2nd Author's Affiliation OMRON Corporation Control components development division
Date 1996/11/15
Paper # EMD96-73
Volume (vol) vol.96
Number (no) 363
Page pp.pp.-
#Pages 6
Date of Issue