Presentation	1996/10/18 Corrosion Mechanism Analysis of Salt Spray Test & SO_2 Test on Gold Plated Connector Contact Tadashi Shintani,
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Abstract(in Japanese)	(See Japanese page)
Abstract(in English)	Gold on the connector contact is superior in the environmental resistance. However, pin holes existing gold film are source to trigger the corrosion reaction between gold and base metal. For examination of contact, it has been popular to apply Salt Spray Test and SO_2 Gas Test. There are some differences of corrosion product between two tests. Main metal making product in Salt Spray is Copper, and main metal in SO_2 is Nickel. To investigate the reason, we have tried to employ the electro-chemical methode. As a result, it was obtained that there was a difference of galvanic cell combination generated through pin hole.
Keyword(in Japanese)	(See Japanese page)
Keyword(in English)	Salt Spray Test / SO_2 Test / Gold plating contact / Corrosion analysis
Paper #	EMD96-61
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Conference Information
Committee	EMD
Conference Date	1996/10/18(1days)
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Paper Information
Registration To	Electromechanical Devices (EMD)
Language	JPN
Title (in Japanese)	(See Japanese page)
Sub Title (in Japanese)	(See Japanese page)
Title (in English)	Corrosion Mechanism Analysis of Salt Spray Test & SO_2 Test on Gold Plated Connector Contact
Sub Title (in English)
Keyword(1)	Salt Spray Test
Keyword(2)	SO_2 Test
Keyword(3)	Gold plating contact
Keyword(4)	Corrosion analysis
1st Author's Name	Tadashi Shintani
1st Author's Affiliation	Japan Aviation Electronics Industry, Limited()
Date	1996/10/18
Paper #	EMD96-61
Volume (vol)	vol.96
Number (no)	318
Page	pp.pp.-
#Pages	6
Date of Issue