Presentation 1997/12/19
Contact Resistance Variation of Printed Circuit Board Connector Due to Thermal Stress and Its Thermal Deformation Measurement by Using Holography
Mikio WATANABE, Takashi TSUCHIYA, Masanari TANIGUCHI, Isamu AKASAKI, Tasuku TAKAGI,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Due to recent trends toward miniaturization and high level current flow in the printed circuit board (PCB) and the connector, the thermal deformation become an important factor to be evaluated from a view point of reliability in the electrical connector. In this study, the contact resistance variation was measured on electrical connector due to thermal stress, and the holography technique was applied to deformation measurement of the electrical connector due to current flow. As the results, the irregularity in contact resistance of contact on the connector was founded, and the deformation pattern of the connector surface due to current flow could be measured with the fringe pattern.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Electrical connector / contact resistance / Thermal stress / Thermal deformation / Holography
Paper # EMD97-73
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Conference Information
Committee EMD
Conference Date 1997/12/19(1days)
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Paper Information
Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Contact Resistance Variation of Printed Circuit Board Connector Due to Thermal Stress and Its Thermal Deformation Measurement by Using Holography
Sub Title (in English)
Keyword(1) Electrical connector
Keyword(2) contact resistance
Keyword(3) Thermal stress
Keyword(4) Thermal deformation
Keyword(5) Holography
1st Author's Name Mikio WATANABE
1st Author's Affiliation Meijo University()
2nd Author's Name Takashi TSUCHIYA
2nd Author's Affiliation Meijo University
3rd Author's Name Masanari TANIGUCHI
3rd Author's Affiliation Meijo University
4th Author's Name Isamu AKASAKI
4th Author's Affiliation Meijo University
5th Author's Name Tasuku TAKAGI
5th Author's Affiliation Nihon University
Date 1997/12/19
Paper # EMD97-73
Volume (vol) vol.97
Number (no) 462
Page pp.pp.-
#Pages 6
Date of Issue