Presentation 1997/8/22
Packaging Technology for a Surface Mount type Optical Transceiver
A. Kawatani, H. Tanaka, H. Fujimi, K. Shuke, K. Kurata, R. Nagaoka,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Achievement of a low cost and small size optical transmitter/receiver is a vital factor in realizing economical subscriber network and trunk line network. To meet such requirement, low cost packaging technology for a surface mount type optical transmitter/receiver is newly developed under the idea of surface mounting and reflow soldering. High productivity and compact size is achieved in this modules by using the hybrid packaging of the optical passive alignment techniques and bare IC mounting technology. The compact optical coupling unit on the Si substrate enabled us to use a surface mount type package. The size of this transmitter/receiver is 10.2×26×3mm each.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Optical transmitter/receiver / Passive alignment / Bare chip mounting / Surface mount
Paper # EMD97-53,CPM97-91,OPE97-69,LQE97-65
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Conference Information
Committee EMD
Conference Date 1997/8/22(1days)
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Paper Information
Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Packaging Technology for a Surface Mount type Optical Transceiver
Sub Title (in English)
Keyword(1) Optical transmitter/receiver
Keyword(2) Passive alignment
Keyword(3) Bare chip mounting
Keyword(4) Surface mount
1st Author's Name A. Kawatani
1st Author's Affiliation Transmission Devices Div. NEC Corporation()
2nd Author's Name H. Tanaka
2nd Author's Affiliation Compound Semiconductor Device Div., NEC Corporation
3rd Author's Name H. Fujimi
3rd Author's Affiliation NEC Engineering, Ltd.
4th Author's Name K. Shuke
4th Author's Affiliation Transmission Devices Div. NEC Corporation
5th Author's Name K. Kurata
5th Author's Affiliation Transmission Devices Div. NEC Corporation
6th Author's Name R. Nagaoka
6th Author's Affiliation Transmission Devices Div. NEC Corporation
Date 1997/8/22
Paper # EMD97-53,CPM97-91,OPE97-69,LQE97-65
Volume (vol) vol.97
Number (no) 232
Page pp.pp.-
#Pages 6
Date of Issue