| Presentation | 1997/8/22 High speed hybrid integrated transmitter module using a planar lightwave circuit platform Takaharu Ohyama, Yuji Akahori, Masahiro Yanagisawa, Hideki Tsunetsugu, Sinji Mino, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | A high speed optoelectronic hybrid integrated transmitter module using a novel silica-based planar lightwave circuit (PLC) platform has been developed. This module consists of a laser diode (LD) array and a LD driver integrated circuit (IC) flip-chip bonded on the PLC platform. The high speed operation was realized employing coplanar waveguides and microstrip lines for the electrical signal transmission lines and two-layer wiring for the power lines that offer electrically stable ground plane. The optical and electrical devices are successfully flip-chip bonded on the same PLC platform by two step bonding process that employed different solder materials. A back-to-back bit-error-rate measurements showed an error-free operation at 9 Gbit/s NRZ signal. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | PLC platform / hybrid integration / solder bump / flip-chip bonding / coplanar waveguide / microstrip line |
| Paper # | EMD97-52,CPM97-90,OPE97-68,LQE97-64 |
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| Conference Information | |
| Committee | EMD |
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| Conference Date | 1997/8/22(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Electromechanical Devices (EMD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | High speed hybrid integrated transmitter module using a planar lightwave circuit platform |
| Sub Title (in English) | |
| Keyword(1) | PLC platform |
| Keyword(2) | hybrid integration |
| Keyword(3) | solder bump |
| Keyword(4) | flip-chip bonding |
| Keyword(5) | coplanar waveguide |
| Keyword(6) | microstrip line |
| 1st Author's Name | Takaharu Ohyama |
| 1st Author's Affiliation | NTT Opto-electronics Laboratories() |
| 2nd Author's Name | Yuji Akahori |
| 2nd Author's Affiliation | NTT Opto-electronics Laboratories |
| 3rd Author's Name | Masahiro Yanagisawa |
| 3rd Author's Affiliation | NTT Opto-electronics Laboratories |
| 4th Author's Name | Hideki Tsunetsugu |
| 4th Author's Affiliation | NTT Opto-electronics Laboratories |
| 5th Author's Name | Sinji Mino |
| 5th Author's Affiliation | NTT Optical Network Systems Laboratories |
| Date | 1997/8/22 |
| Paper # | EMD97-52,CPM97-90,OPE97-68,LQE97-64 |
| Volume (vol) | vol.97 |
| Number (no) | 232 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |