| Presentation | 1997/8/22 A New Packaging Technique using Lead-less Super Broadband(LSuB) carrier for High-speed IC module Masakaze Hosoya, Nobuo Sato, Hideki Tsunetsugu, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | This paper reviews a new packaging technique using Lead-Less Super Broadband (LSuB) carrier for high-speed IC module. The LSuB carrier drastically reduces the parasitic inductive elements of the interconnection between IC and package terminals, and provides an impedance matched interconnection. The LSuB carrier realized the insertion loss of less than 1.3 dB from DC to 50 GHz. The fabricated package module using the LSuB carrier achieved a 3-dB bandwidth of more over 40 GHz. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | interconnection / solder bump / film carrier / broadband module |
| Paper # | EMD97-51,CPM97-89,OPE97-67,LQE97-63 |
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| Conference Information | |
| Committee | EMD |
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| Conference Date | 1997/8/22(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
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| Assistant | |
| Paper Information | |
| Registration To | Electromechanical Devices (EMD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | A New Packaging Technique using Lead-less Super Broadband(LSuB) carrier for High-speed IC module |
| Sub Title (in English) | |
| Keyword(1) | interconnection |
| Keyword(2) | solder bump |
| Keyword(3) | film carrier |
| Keyword(4) | broadband module |
| 1st Author's Name | Masakaze Hosoya |
| 1st Author's Affiliation | NTT Opto-electronics Laboratories() |
| 2nd Author's Name | Nobuo Sato |
| 2nd Author's Affiliation | NTT Opto-electronics Laboratories |
| 3rd Author's Name | Hideki Tsunetsugu |
| 3rd Author's Affiliation | NTT Opto-electronics Laboratories |
| Date | 1997/8/22 |
| Paper # | EMD97-51,CPM97-89,OPE97-67,LQE97-63 |
| Volume (vol) | vol.97 |
| Number (no) | 232 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |