Presentation | 1997/4/18 Room temperature silicon wafer direct bonding and its applicability to micro bonding Hideki Takagi, Ryutaro Maeda, Tadatomo Suga, |
---|---|
PDF Download Page | PDF download Page Link |
Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | We have developed a new method for the direct bonding of silicon wafers at room temperature. In the method Ar beam etching is used to modify the surface of the specimens, and they are bonded in vacuum. The bonding prepared by the method is as strong as conventional wafer fusion bonding. Pressing load is not necessary when two specimens are mated. Also, this method does not need ultrahigh vacuum condition. Especially, the influence of inert gas in the vacuum chamber is quite small. Even in the 1000Pa of Ar, strong bonding can be attained. This method can be applied to the small area bonding of 100μm wide lines. These results demonstrate the advantages of this method in assembling and packaging of MEMS. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Room temperature bonding / Direct bonding / Silicon wafer / Ar beam etching / Micro bonding |
Paper # | EMD97-5 |
Date of Issue |
Conference Information | |
Committee | EMD |
---|---|
Conference Date | 1997/4/18(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
Vice Chair | |
Secretary | |
Assistant |
Paper Information | |
Registration To | Electromechanical Devices (EMD) |
---|---|
Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Room temperature silicon wafer direct bonding and its applicability to micro bonding |
Sub Title (in English) | |
Keyword(1) | Room temperature bonding |
Keyword(2) | Direct bonding |
Keyword(3) | Silicon wafer |
Keyword(4) | Ar beam etching |
Keyword(5) | Micro bonding |
1st Author's Name | Hideki Takagi |
1st Author's Affiliation | Mechanical Engineering Laboratory, AIST. MITI.() |
2nd Author's Name | Ryutaro Maeda |
2nd Author's Affiliation | Mechanical Engineering Laboratory, AIST. MITI. |
3rd Author's Name | Tadatomo Suga |
3rd Author's Affiliation | Research Center for Advanced Science and Technology, Univ. Tokyo |
Date | 1997/4/18 |
Paper # | EMD97-5 |
Volume (vol) | vol.97 |
Number (no) | 12 |
Page | pp.pp.- |
#Pages | 5 |
Date of Issue |