| Presentation | 2000/9/15 Analysis of Millimeter-wave Packaging Structure Using Electromagnetic Simulator and Its Application to W-band Package Masaharu Ito, Kenichi Maruhashi, Kazuhiro Ikuina, Keiichi Ohata, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | A low cost ceramic packaging structure with flip-chip interconnects has been developed using a 3D-electromagnetic simulator for millimeter-wave applications. An improved coplanar waveguide and a feedthru structure are proposed to reduce radiation loss and to satisfy mass production design rule for multi-layer ceramic technology. A ceramic package with the developed structure was fabricated for MMICs up to W-band. The measured 76GHz amplifier MMIC flipped on the package showed a good performance. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | millimeter-wave / EM simulation / MMIC / multi-layer ceramic package / flip-chip / CPW |
| Paper # | ED2000-154,MW2000-107 |
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| Conference Information | |
| Committee | MW |
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| Conference Date | 2000/9/15(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
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| Assistant | |
| Paper Information | |
| Registration To | Microwaves (MW) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Analysis of Millimeter-wave Packaging Structure Using Electromagnetic Simulator and Its Application to W-band Package |
| Sub Title (in English) | |
| Keyword(1) | millimeter-wave |
| Keyword(2) | EM simulation |
| Keyword(3) | MMIC |
| Keyword(4) | multi-layer ceramic package |
| Keyword(5) | flip-chip |
| Keyword(6) | CPW |
| 1st Author's Name | Masaharu Ito |
| 1st Author's Affiliation | System Devices and Fundamental Research, NEC Corporation() |
| 2nd Author's Name | Kenichi Maruhashi |
| 2nd Author's Affiliation | System Devices and Fundamental Research, NEC Corporation |
| 3rd Author's Name | Kazuhiro Ikuina |
| 3rd Author's Affiliation | Functional Devices and Materials Research, NEC Corporation |
| 4th Author's Name | Keiichi Ohata |
| 4th Author's Affiliation | System Devices and Fundamental Research, NEC Corporation |
| Date | 2000/9/15 |
| Paper # | ED2000-154,MW2000-107 |
| Volume (vol) | vol.100 |
| Number (no) | 308 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |