Presentation 2002/1/9
Surface Mount Technology for Over-40-Gb/s ICs
Hirohiko SUGAHARA, Shunji KIMURA, Koichi MURATA, Hiroyuki TOMIYAMA, Eiichi SANO,
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Abstract(in English) A new surface mount technology for over-40-Gb/s ICs has been developed. The technology features 8-mm-square leadless chip carrier packages and four-layer resin printed circuit boards. It was applied to build a prototype InP HFET multichip 1 : 4 DEMUX module, that operates at 45 Gb/s. This technology is promising for small, low-cost IC modules for over-40-Gb/s optical communication systems.
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Keyword(in English) 40 Gb/s / surface mount technology / IC package / IC module
Paper # 2001-ED-191,2001-MW-146,2001-ICD-188
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Conference Date 2002/1/9(1days)
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Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Surface Mount Technology for Over-40-Gb/s ICs
Sub Title (in English)
Keyword(1) 40 Gb/s
Keyword(2) surface mount technology
Keyword(3) IC package
Keyword(4) IC module
1st Author's Name Hirohiko SUGAHARA
1st Author's Affiliation NTT Photonics Laboratories, NTT Corporation()
2nd Author's Name Shunji KIMURA
2nd Author's Affiliation NTT Photonics Laboratories, NTT Corporation
3rd Author's Name Koichi MURATA
3rd Author's Affiliation NTT Photonics Laboratories, NTT Corporation
4th Author's Name Hiroyuki TOMIYAMA
4th Author's Affiliation NTT Advanced Technology Corporation
5th Author's Name Eiichi SANO
5th Author's Affiliation NTT Photonics Laboratories, NTT Corporation:(Present address) Currently at Hokkaido University
Date 2002/1/9
Paper # 2001-ED-191,2001-MW-146,2001-ICD-188
Volume (vol) vol.101
Number (no) 555
Page pp.pp.-
#Pages 5
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