Presentation 2001/12/14
Surface-mountable Optical-I/O chip Packages for Chip-to-chip Optical Interconnections
Yuzo ISHII, Hideyuki TAKAHARA,
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Abstract(in English) Newly developed optical-I/O Packages for future chip-to-chip optical interconnections are described. Our developed plastic-BGA(Ball grid Array)Packages contain 3ch-VCSEL array chip and a driver ASIC to operate parallel optical transmission at 1.25 Gbits/S/ch. We also demonstrated the "OptoBump" interface that tolerates unavoidable misalignments as large as ± 100 μm between the package and a motherboard during a surface-mount process. Through this work, we verified the feasibility and availability of the optical-I/O chip package.
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Keyword(in English) Optical interconnection / Photonic packaging / Microlens / Surface-mount technology / VCSEL
Paper # CPM-122,ICD-174
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Conference Date 2001/12/14(1days)
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Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Surface-mountable Optical-I/O chip Packages for Chip-to-chip Optical Interconnections
Sub Title (in English)
Keyword(1) Optical interconnection
Keyword(2) Photonic packaging
Keyword(3) Microlens
Keyword(4) Surface-mount technology
Keyword(5) VCSEL
1st Author's Name Yuzo ISHII
1st Author's Affiliation NTT Telecommunications Energy Laboratories()
2nd Author's Name Hideyuki TAKAHARA
2nd Author's Affiliation NTT Telecommunications Energy Laboratories
Date 2001/12/14
Paper # CPM-122,ICD-174
Volume (vol) vol.101
Number (no) 519
Page pp.pp.-
#Pages 8
Date of Issue