Presentation | 2001/12/14 Surface-mountable Optical-I/O chip Packages for Chip-to-chip Optical Interconnections Yuzo ISHII, Hideyuki TAKAHARA, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Newly developed optical-I/O Packages for future chip-to-chip optical interconnections are described. Our developed plastic-BGA(Ball grid Array)Packages contain 3ch-VCSEL array chip and a driver ASIC to operate parallel optical transmission at 1.25 Gbits/S/ch. We also demonstrated the "OptoBump" interface that tolerates unavoidable misalignments as large as ± 100 μm between the package and a motherboard during a surface-mount process. Through this work, we verified the feasibility and availability of the optical-I/O chip package. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Optical interconnection / Photonic packaging / Microlens / Surface-mount technology / VCSEL |
Paper # | CPM-122,ICD-174 |
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Conference Information | |
Committee | ICD |
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Conference Date | 2001/12/14(1days) |
Place (in Japanese) | (See Japanese page) |
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Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Integrated Circuits and Devices (ICD) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Surface-mountable Optical-I/O chip Packages for Chip-to-chip Optical Interconnections |
Sub Title (in English) | |
Keyword(1) | Optical interconnection |
Keyword(2) | Photonic packaging |
Keyword(3) | Microlens |
Keyword(4) | Surface-mount technology |
Keyword(5) | VCSEL |
1st Author's Name | Yuzo ISHII |
1st Author's Affiliation | NTT Telecommunications Energy Laboratories() |
2nd Author's Name | Hideyuki TAKAHARA |
2nd Author's Affiliation | NTT Telecommunications Energy Laboratories |
Date | 2001/12/14 |
Paper # | CPM-122,ICD-174 |
Volume (vol) | vol.101 |
Number (no) | 519 |
Page | pp.pp.- |
#Pages | 8 |
Date of Issue |