Presentation 2001/5/18
Vision Chip Fabricated by using Three Dimensional Integration Technology
Hiroyuki Kurino, Yoshihiro Nakagawa, Kang Wook Lee, Tomonori Nakamura, Yuusuke Yamada, Tetu Morooka, Kiyoshi Inamura, Ki Tae Park, Mitsumasa Koyanagi,
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Abstract(in English) The smart vision chip has a large potential for application in general purpose high speed image processing systems. In order to fabricate smart vision chips including photo detector compactly, we have proposed the application of three dimensional LSI technology for smart vision chips. Three dimensional technology also has great potential to realize new neuromorphic systems inspired by not only the biological function but also the biological structure. In this paper, we describe our three dimensional LSI technology for neuromorphic circuits and the design of smart vision chips.
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Keyword(in English) Three Dimensional Integration Technology / Vision Chip / LSI / Package / Neuromorphic System
Paper # ICD2001-28
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Conference Date 2001/5/18(1days)
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Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Vision Chip Fabricated by using Three Dimensional Integration Technology
Sub Title (in English)
Keyword(1) Three Dimensional Integration Technology
Keyword(2) Vision Chip
Keyword(3) LSI
Keyword(4) Package
Keyword(5) Neuromorphic System
1st Author's Name Hiroyuki Kurino
1st Author's Affiliation Dept. of Machine Intelligence and Systems Engineering, Tohoku University()
2nd Author's Name Yoshihiro Nakagawa
2nd Author's Affiliation Dept. of Machine Intelligence and Systems Engineering, Tohoku University
3rd Author's Name Kang Wook Lee
3rd Author's Affiliation Japan Science and Technology Corporation
4th Author's Name Tomonori Nakamura
4th Author's Affiliation Dept. of Machine Intelligence and Systems Engineering, Tohoku University
5th Author's Name Yuusuke Yamada
5th Author's Affiliation Dept. of Machine Intelligence and Systems Engineering, Tohoku University
6th Author's Name Tetu Morooka
6th Author's Affiliation Dept. of Machine Intelligence and Systems Engineering, Tohoku University
7th Author's Name Kiyoshi Inamura
7th Author's Affiliation Dept. of Machine Intelligence and Systems Engineering, Tohoku University
8th Author's Name Ki Tae Park
8th Author's Affiliation Dept. of Machine Intelligence and Systems Engineering, Tohoku University
9th Author's Name Mitsumasa Koyanagi
9th Author's Affiliation Dept. of Machine Intelligence and Systems Engineering, Tohoku University
Date 2001/5/18
Paper # ICD2001-28
Volume (vol) vol.101
Number (no) 85
Page pp.pp.-
#Pages 7
Date of Issue