Presentation 2001/1/11
High Efficiency Power Amplifier Module with Novel Enhancement-Mode Heterojunction FETs for Wide-Band CDMA Handsets
Yasunori Bito, Takehiko Kato, Teruhisa Kato, Naotaka Iwata,
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Abstract(in English) A 0.1cc highly efficient power amplitie multi chip module (MCM) employing novel enhancement-mode double-doped AlGaAs/InGaAs/AlGaAs heterojunction FETs (HJFET) has been successfully developed for 1.9GHz wide-band CDMA (W=CDMA) handsets. The HJFET has a 5nm thickness Al_<0.5>Ga_<0.5>As barrier layer for improving a gate forward turn-on voltage. It was also optimized with thickness of upper and lower Al_<0.2>Ga_<0.8>As electron supply layers to obtain a high maximum drain current. Under single 3.5V operation, the two-stage power amplifier MCM exhibited 26.0dBm output power, a record 47.2% power-added efficiency (PAE) and 22.3dB associated gain at W-CDMA distortion criteria. Even operated at a reducated the developed MCM is promising for W-CDMA handsets.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) W-CDMA / MCM / Enhancement-mode HJFET / Gate turn-on voltage / Al_<0.5>Ga_<0.5>As barrier layer
Paper # ED2000-230,MW2000-179,ICD2000-190
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Committee ICD
Conference Date 2001/1/11(1days)
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Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) High Efficiency Power Amplifier Module with Novel Enhancement-Mode Heterojunction FETs for Wide-Band CDMA Handsets
Sub Title (in English)
Keyword(1) W-CDMA
Keyword(2) MCM
Keyword(3) Enhancement-mode HJFET
Keyword(4) Gate turn-on voltage
Keyword(5) Al_<0.5>Ga_<0.5>As barrier layer
1st Author's Name Yasunori Bito
1st Author's Affiliation Compound Semiconductor Device Division, NEC Corporation()
2nd Author's Name Takehiko Kato
2nd Author's Affiliation Compound Semiconductor Device Division, NEC Corporation
3rd Author's Name Teruhisa Kato
3rd Author's Affiliation Naito Densei Machida Mfg. Co., Ltd.
4th Author's Name Naotaka Iwata
4th Author's Affiliation Compound Semiconductor Device Division, NEC Corporation
Date 2001/1/11
Paper # ED2000-230,MW2000-179,ICD2000-190
Volume (vol) vol.100
Number (no) 554
Page pp.pp.-
#Pages 6
Date of Issue