| Presentation | 1994/11/24 A low-cost silicon-on-silicon MCM Teruo Kusaka, Atsushi Nishizawa, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In order to increase their use,MCMs must be cheaper than SMDs.To realize this aim,we have developed a low cost Si-on-Si MCM.It is characterized as follows; (1)The silicon circuit substrate is almost the same size as large chips,and only small chips are mounted on the substrate. (2)The wirings are formed with a very fine pitch of less than 15 um,similar to LSI wirings,due to the short lenghts required for interconnections on the small substrate. (3)The Si-on-Si unit can be packaged with a standard LSI package and can be assembled with a conventional assembly process. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | silicon-on-silicon / multichip module / flipchip bonding / low- cost / manufacturing |
| Paper # | ICD94-146 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 1994/11/24(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | A low-cost silicon-on-silicon MCM |
| Sub Title (in English) | |
| Keyword(1) | silicon-on-silicon |
| Keyword(2) | multichip module |
| Keyword(3) | flipchip bonding |
| Keyword(4) | low- cost |
| Keyword(5) | manufacturing |
| 1st Author's Name | Teruo Kusaka |
| 1st Author's Affiliation | ULSI Device Development Laboratorys,NEC Corporation() |
| 2nd Author's Name | Atsushi Nishizawa |
| 2nd Author's Affiliation | ULSI Device Development Laboratorys,NEC Corporation |
| Date | 1994/11/24 |
| Paper # | ICD94-146 |
| Volume (vol) | vol.94 |
| Number (no) | 360 |
| Page | pp.pp.- |
| #Pages | 7 |
| Date of Issue | |