| Presentation | 1994/11/24 Development of MCM-L and its technologies Yutaka Tsukada, |
|---|---|
| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | MCM-L has been classified as a lower level technology compared with MCM-D and MCM-C in the past and not considered for high performance applications.However,it is a doptible for applications over 200MHz when utilizing high density printed circuit board with build up structure and bare chip attach by flipchip bonding.This paper describes the elements of technolgy for MCM-L which are substrate,chip attach,encapsulation,cooling and desing tool, particulary the electrical performance of the substrate and the method of chip attach to the organic material substrate. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Build-up structure / Flipchip bonding / Quasi module / Ball Grid Array |
| Paper # | ICD94-145 |
| Date of Issue |
| Conference Information | |
| Committee | ICD |
|---|---|
| Conference Date | 1994/11/24(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Development of MCM-L and its technologies |
| Sub Title (in English) | |
| Keyword(1) | Build-up structure |
| Keyword(2) | Flipchip bonding |
| Keyword(3) | Quasi module |
| Keyword(4) | Ball Grid Array |
| 1st Author's Name | Yutaka Tsukada |
| 1st Author's Affiliation | Yasu laboratory,IBM Japan() |
| Date | 1994/11/24 |
| Paper # | ICD94-145 |
| Volume (vol) | vol.94 |
| Number (no) | 360 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |