Presentation 1999/1/21
Fabrication of Submillimeter Components Using UV-curable Photosensitive plastics
Tetze Hamano, M.Lubecke Victor, Koji Mizuno,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) High performance circuits in millimeter and submillimeter wave regions require the employment of extremely small three-dimensional waveguides and other components. The fabrication of the submillimeter wave circuits is quite difficult as well as much costly by the conventional machining technique. Micromachining technique can be employed to solve the fabrication problem. We have developed the photolithography technique for the production of submillimeter wave components using ultra-thick UV-curable resin for micromachining technique, while such technique can be extremely process sensitive. The technique can allow the batch production of a number of submillimeter-sized components simultaneously. We have demonstrated waveguide backshorts in the frequency ranges of 2.5 THz and 640 GHz as well as dichroic plates for 640 GHz. The UV-curable resin can be useful to fabricate submillimeter wave components, due to its possibility of the complicated structure having a high aspect ratio more than 10.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Submillimeter waves / Waveguide components / UV-curable resin / MEMS
Paper # ED98-198,MW98-161,ICD98-265
Date of Issue

Conference Information
Committee ICD
Conference Date 1999/1/21(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Fabrication of Submillimeter Components Using UV-curable Photosensitive plastics
Sub Title (in English)
Keyword(1) Submillimeter waves
Keyword(2) Waveguide components
Keyword(3) UV-curable resin
Keyword(4) MEMS
1st Author's Name Tetze Hamano
1st Author's Affiliation Research Institute of Electrical Communication, Tohoku University()
2nd Author's Name M.Lubecke Victor
2nd Author's Affiliation Photodynamics Research Center, The Institute of Physical and Chemical Research(RIKEN). :)Presen address)Presently with Bell Laboratory, Lucent Technologies
3rd Author's Name Koji Mizuno
3rd Author's Affiliation Research Institute of Electrical Communication, Tohoku University
Date 1999/1/21
Paper # ED98-198,MW98-161,ICD98-265
Volume (vol) vol.98
Number (no) 524
Page pp.pp.-
#Pages 6
Date of Issue