Presentation 1998/8/21
Technical Research on Substrate Noise in CMOS Mixed-Signal ICs
Toshiro Tsukada, Makie Keiko Fukuda,
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Abstract(in English) Substrate noise coupling is a critical problem in large-scale integration of mixed analog and digital circuits. This paper describes noise coupling through the substrate in CMOS integrated circuits and reviews recent technical approaches to measuring, analyzing, and reducing the noise coupling. In measurements, substrate noise is detected either by the gate or the backgate of on-chip MOS trasistor. A comparator-based noise measurement method is useful for digital signal processing. Popular noise reduction techniques are applicable to the noise source, noise path, and noise receiver. Future mixed-signal ICs will need systematic techniques such as "active guard band filtering" and digital error correction. Efficient CAD methods will become the key to realizing these techniques for substrate noise decoupling.
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Keyword(in English) CMOS / body effect / substrate noise coupling / analog and mixed-signal IC
Paper # ICD98-132
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Conference Date 1998/8/21(1days)
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Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Technical Research on Substrate Noise in CMOS Mixed-Signal ICs
Sub Title (in English)
Keyword(1) CMOS
Keyword(2) body effect
Keyword(3) substrate noise coupling
Keyword(4) analog and mixed-signal IC
1st Author's Name Toshiro Tsukada
1st Author's Affiliation Multi-Media LSI Development Cenmter, System LSI Business Operation Semiconductor & Integrated Circuits Div., Hitachi, Ltd.()
2nd Author's Name Makie Keiko Fukuda
2nd Author's Affiliation Multi-Media LSI Development Cenmter, System LSI Business Operation Semiconductor & Integrated Circuits Div., Hitachi, Ltd.
Date 1998/8/21
Paper # ICD98-132
Volume (vol) vol.98
Number (no) 245
Page pp.pp.-
#Pages 8
Date of Issue