Presentation 1998/3/6
Development of Communication Protocol LSI Chips for Wireless Tele-Metering System
Shiobara, Yokoyama, Masu, Tubouchi,
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Abstract(in English) The application specifiled LSI chips with low power consumption and high performance is required for variouswireless communication applications.In this paper, we have developed the simulator for implentingcommunication protocol.The newly developed simulator can cosimulate both hardware and software in the functional design level.Combining this simulator and the commercially available EDA tools, we have implemented the application specified protocol LSI chips for the tele-metering system.
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Keyword(in English) HDL / Hardware/Software co-simulation / tele-metering / protocol
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Conference Date 1998/3/6(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Development of Communication Protocol LSI Chips for Wireless Tele-Metering System
Sub Title (in English)
Keyword(1) HDL
Keyword(2) Hardware/Software co-simulation
Keyword(3) tele-metering
Keyword(4) protocol
1st Author's Name Shiobara
1st Author's Affiliation Reserach Institute of Electrical Communication, Tohoku University()
2nd Author's Name Yokoyama
2nd Author's Affiliation Research Institute of Electrical Communication, Tohoku University
3rd Author's Name Masu
3rd Author's Affiliation Research Institute of Electrical Communication, Tohoku University
4th Author's Name Tubouchi
4th Author's Affiliation Reseach Institute of Electrical Communication, Tohoku University
Date 1998/3/6
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Volume (vol) vol.97
Number (no) 579
Page pp.pp.-
#Pages 8
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