Presentation 1998/1/21
Temperture compensation technique of GaAs FET by rotating the gate orientation
H. Furukawa, T. Tanaka, H. Ishida, D. Ueda,
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Abstract(in English) A temperature compensation technique of GaAs FET has been studied. It is found that temperature dependence of the drain current and the threshold voltage of GaAs FET is strongly related to the gate orientation. It is revealed that the cause of the temperature dependence is piezoelectric charges that are induced in the chip by a mechanical stress. The origin of the stress is a difference of thermal expansion coefficient of GaAs and base metal of leadframe. Based on the relation between the piezoelectric effect and the temperature dependence, we found a technique of temperature compensation of the drain current used for GaAs FET by rotating the gate orientation.
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Keyword(in English) powerFET / temperature dependence / stress / piezo-electric effect / power amplifier / thermal runaway
Paper # ICD97-196
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Conference Date 1998/1/21(1days)
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Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Temperture compensation technique of GaAs FET by rotating the gate orientation
Sub Title (in English)
Keyword(1) powerFET
Keyword(2) temperature dependence
Keyword(3) stress
Keyword(4) piezo-electric effect
Keyword(5) power amplifier
Keyword(6) thermal runaway
1st Author's Name H. Furukawa
1st Author's Affiliation Electronics Research Laboratory, Matsushita Electronics Corporation()
2nd Author's Name T. Tanaka
2nd Author's Affiliation Electronics Research Laboratory, Matsushita Electronics Corporation
3rd Author's Name H. Ishida
3rd Author's Affiliation Electronics Research Laboratory, Matsushita Electronics Corporation
4th Author's Name D. Ueda
4th Author's Affiliation Electronics Research Laboratory, Matsushita Electronics Corporation
Date 1998/1/21
Paper # ICD97-196
Volume (vol) vol.97
Number (no) 480
Page pp.pp.-
#Pages 6
Date of Issue