Presentation 1998/1/21
Novel Fabrication Technology for Ultra-Compact Three-Dimensional MMICs
Suehiro Sugitani, Kiyomitsu Onodera, Shinji Aoyama, Makoto Hirano, Kimiyoshi Yamasaki,
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Abstract(in English) A novel fabrication technology has been developed for ultra-compact three-dimensional (3D) MMICs. The key feature is an advanced polyimide etching process using inductively-coupled-plasma (ICP) etching with a double-layer mask, which is WSi metal covered with Si-containing photoresist. The sophisticated 3D structure with many kinds of via has been successfully fabricated in 10-μm-thick of polyimide using this technology. A unique inductor with vertical structure has been successfully fabricated. As result, circuit designers can take advantage of smaller chip area and get higher performance and greater design flexibility in MMICs.
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Keyword(in English) GaAs / MMIC / 3D passive circuit / polyimide / etching / via / inductor
Paper # ICD97-195
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Conference Date 1998/1/21(1days)
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Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Novel Fabrication Technology for Ultra-Compact Three-Dimensional MMICs
Sub Title (in English)
Keyword(1) GaAs
Keyword(2) MMIC
Keyword(3) 3D passive circuit
Keyword(4) polyimide
Keyword(5) etching
Keyword(6) via
Keyword(7) inductor
1st Author's Name Suehiro Sugitani
1st Author's Affiliation NTT System Electronics Laboratories()
2nd Author's Name Kiyomitsu Onodera
2nd Author's Affiliation NTT System Electronics Laboratories
3rd Author's Name Shinji Aoyama
3rd Author's Affiliation NTT System Electronics Laboratories
4th Author's Name Makoto Hirano
4th Author's Affiliation NTT System Electronics Laboratories
5th Author's Name Kimiyoshi Yamasaki
5th Author's Affiliation NTT System Electronics Laboratories
Date 1998/1/21
Paper # ICD97-195
Volume (vol) vol.97
Number (no) 480
Page pp.pp.-
#Pages 8
Date of Issue