| Presentation | 1997/12/11 Shape Evolution of Electrodeposited Bumps : Effect of Resist Angle Kazuo Kondo, Zennosuke Tanaka, Keisuke Fukui, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The current distribution of electrodeposited bumps is discussed based on the secondary and mass transfer-limited current distributions. The secondary current distribution shows that zero or negative resist wall angle reduce current at cathode corners and prevent side bumping. Large Wa number also prevent side bumping. The mass transfer-limited current distribution shows that zero or negative angle reduce diffusion from the outer surroundings and enhance vortices formation at the cathode corners. Reduction in the diffusion and enhancement invortices reduce current at the cathode corners and prevent side bumpings. Current distribution for resit angles of -10, 0, 30゜is obtained for the Pe numbers of 1.31, 41.6 and 1407.2. The mass transfer machanism behind these current distributions is discussed in details based on the vortex formation and surrounding diffusion. A guide to prevent side bumping is summarized in the summary. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Packaging / Interconnection / Bumping / Electrodeposition / Resist side wall angle |
| Paper # | ICD97-182 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 1997/12/11(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
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| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Shape Evolution of Electrodeposited Bumps : Effect of Resist Angle |
| Sub Title (in English) | |
| Keyword(1) | Packaging |
| Keyword(2) | Interconnection |
| Keyword(3) | Bumping |
| Keyword(4) | Electrodeposition |
| Keyword(5) | Resist side wall angle |
| 1st Author's Name | Kazuo Kondo |
| 1st Author's Affiliation | University of Okayama() |
| 2nd Author's Name | Zennosuke Tanaka |
| 2nd Author's Affiliation | University of Okayama |
| 3rd Author's Name | Keisuke Fukui |
| 3rd Author's Affiliation | Himeji Institute of Techonlogy |
| Date | 1997/12/11 |
| Paper # | ICD97-182 |
| Volume (vol) | vol.97 |
| Number (no) | 435 |
| Page | pp.pp.- |
| #Pages | 7 |
| Date of Issue | |