| Presentation | 1997/12/11 Ultra High-Speed GaAs MESFET IC Modules using Flip Chip Bonding Technique Hiroyuki Kikuchi, Hideki Tsunetsugu, Makoto Hirano, Yuhki Imai, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In order to realize ultra high-speed modules for 40 Gbit/s optical transmission systems, distributed amplifier and signal distributor ICs have been developed using inverted microstrip line design technique and 0.1-μm-gate-length GaAs MESFET with a multilayer interconnection structure. These ICs were mounted in a chip-size-cavity package using transferred microsolder bumps. An amplifier module achieved a 3 dB bandwidth of more than 50 GHz and a gain of 8 dB. A 3 dB bandwidth of a signal distributor was 40 GHz and a loss was 2 dB. These modules were demonstrated at 40 Gbit/s. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | GaAs MESFET / Amplifier / Distributor / Microstrip line / Flip chip / Bump |
| Paper # | ICD97-177 |
| Date of Issue |
| Conference Information | |
| Committee | ICD |
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| Conference Date | 1997/12/11(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Ultra High-Speed GaAs MESFET IC Modules using Flip Chip Bonding Technique |
| Sub Title (in English) | |
| Keyword(1) | GaAs MESFET |
| Keyword(2) | Amplifier |
| Keyword(3) | Distributor |
| Keyword(4) | Microstrip line |
| Keyword(5) | Flip chip |
| Keyword(6) | Bump |
| 1st Author's Name | Hiroyuki Kikuchi |
| 1st Author's Affiliation | NTT Optical Network Systems Laboratories() |
| 2nd Author's Name | Hideki Tsunetsugu |
| 2nd Author's Affiliation | NTT Opto-electronics Laboratories |
| 3rd Author's Name | Makoto Hirano |
| 3rd Author's Affiliation | NTT System Electronics Laboratories |
| 4th Author's Name | Yuhki Imai |
| 4th Author's Affiliation | NTT Electronics Corporation |
| Date | 1997/12/11 |
| Paper # | ICD97-177 |
| Volume (vol) | vol.97 |
| Number (no) | 435 |
| Page | pp.pp.- |
| #Pages | 7 |
| Date of Issue | |