Presentation 1997/9/26
An Analisys on Hi-Frequency Interconnections in VLSI Considering Skin Effect
T. Mido, M. Aoyagi, K. Asada,
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Abstract(in English) It will be very important for future large integrated and high speed digital system to be considered interconnection optimization. In operation of over GHz region, it need to consider the skin effect. In this study, we developed a two dimensional skin effect simulator by using the split fiber model, that can treat the skin effect as inductive phenomenon of metal wires. Using this simulator, we calculate propagation delay as the function of wiring aspect ratio with considering skin effect. We found that it need to consider the skin effect in under 1GHz operation. Finally, we evaluate the effectiveness of lamination wire in reducing skin effect.
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Keyword(in English) VLSI / Interconnections / Skin Effect / Wiring Delay / Capacitance / Cross-sectional Aspect Ratio
Paper # ICD97-144
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Conference Date 1997/9/26(1days)
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Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) An Analisys on Hi-Frequency Interconnections in VLSI Considering Skin Effect
Sub Title (in English)
Keyword(1) VLSI
Keyword(2) Interconnections
Keyword(3) Skin Effect
Keyword(4) Wiring Delay
Keyword(5) Capacitance
Keyword(6) Cross-sectional Aspect Ratio
1st Author's Name T. Mido
1st Author's Affiliation Department of Electronic Engineering, University of Tokyo:VDEC, Univ. of Tokyo()
2nd Author's Name M. Aoyagi
2nd Author's Affiliation Department of Electronic Engineering, University of Tokyo:VDEC, Univ. of Tokyo
3rd Author's Name K. Asada
3rd Author's Affiliation Department of Electronic Engineering, University of Tokyo:VDEC, Univ. of Tokyo
Date 1997/9/26
Paper # ICD97-144
Volume (vol) vol.97
Number (no) 275
Page pp.pp.-
#Pages 7
Date of Issue