Presentation 1997/7/25
Shallow Trench Isolation Characteristics with High-Density-Plasma (HDP) CVD Oxide for Deep-Submicron CMOS Technologies
Seungho Lee, Kuchul Jung, Sungwoong Chung, Jeongdong Choe, Wouns Yang, Youngjong Lee, Jinwon Park,
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Abstract(in English) This paper systematically studies STI characteristics with deposition conditions of High Density Plasma CVD oxide gap-fill material, together with trench sidewall oxide thicknesses. The results show negligible sputter effect of HDP even with low Deposition/Sputter ratio and Si etch damage on the trench sidewall surface observed from leakage current. The leakage current is, however, mainly introduced from the weak trench top corners due to post CMP processes when they are exposed during successive HF cleanings in weak active edges. The results also show excellent isolation characteristics and narrow width effect.
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Keyword(in English) Shallow Trench Isolation / Gap-Fill Material / Trench Sidewall Oxide / HDP Oxide
Paper # ICD97-80
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Conference Date 1997/7/25(1days)
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Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Shallow Trench Isolation Characteristics with High-Density-Plasma (HDP) CVD Oxide for Deep-Submicron CMOS Technologies
Sub Title (in English)
Keyword(1) Shallow Trench Isolation
Keyword(2) Gap-Fill Material
Keyword(3) Trench Sidewall Oxide
Keyword(4) HDP Oxide
1st Author's Name Seungho Lee
1st Author's Affiliation Advanced Technology Laboratory, LG Semicon Co.,()
2nd Author's Name Kuchul Jung
2nd Author's Affiliation Advanced Technology Laboratory, LG Semicon Co.,
3rd Author's Name Sungwoong Chung
3rd Author's Affiliation Device Group, Process Group
4th Author's Name Jeongdong Choe
4th Author's Affiliation Device Group, Process Group
5th Author's Name Wouns Yang
5th Author's Affiliation Advanced Technology Laboratory, LG Semicon Co.,
6th Author's Name Youngjong Lee
6th Author's Affiliation Advanced Technology Laboratory, LG Semicon Co.,
7th Author's Name Jinwon Park
7th Author's Affiliation Device Group, Process Group
Date 1997/7/25
Paper # ICD97-80
Volume (vol) vol.97
Number (no) 198
Page pp.pp.-
#Pages 5
Date of Issue