Presentation 2001/9/21
A Dummy Pattern Design System Based on A CMP Model
Toshiyuki Ohta,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) A dummy pattern design system based on a CMP model is developed to reduce the global thickness variation by CMP process. Input data are GDS II formatted which is standard of LSI design. It is found that effective design has become possible because this system cooperates pattern density calculations, CMP simulations, graphics, and dummy pattern design through GUI.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) CMP / Dummy Pattern / Simulation / LSI Design
Paper # VLD2001-75,SDM2001-149
Date of Issue

Conference Information
Committee SDM
Conference Date 2001/9/21(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Dummy Pattern Design System Based on A CMP Model
Sub Title (in English)
Keyword(1) CMP
Keyword(2) Dummy Pattern
Keyword(3) Simulation
Keyword(4) LSI Design
1st Author's Name Toshiyuki Ohta
1st Author's Affiliation Semiconductor Leading Edge Technologies, Inc.()
Date 2001/9/21
Paper # VLD2001-75,SDM2001-149
Volume (vol) vol.101
Number (no) 321
Page pp.pp.-
#Pages 5
Date of Issue