Presentation 2001/3/5
Al_2O_3/Si_3N_4 buffer layer for MFIS structures
Yoshihisa Fujisaki, Hiroshi Ishiwara,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The Al_2O_3 thin film was deposited on the N_2 radical Si_3N_4 that was proved to have high oxidation resistance. The 3.5nm-thick Al_2O_3 film was proved to have the permittivity of 9.76 in this stacked Al_2O_3/Si_3N_4 structure. During the Al_2O_3 deposition process, Si_3N_4/Si interface showed no degradation that is attributable to the high oxidation resistance of radical Si_3N_4 film. The MIS (Metal Insulator Semiconductor) diode with Al_2O_3/Si_3N_4 realized 10^5 times smaller leakage current compared to the MIS diode with Si_3N_4 that has similar capacitance density to the former one. We showed the stacked Al_2O_3/Si_3N_4 insulator has enough stability as a buffer layer in MFIS (Metal Ferroelectric Insulator Semiconductor) devices.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Nitrogen radical / alumina / damage-free / ferroelectric transistor
Paper # SDM2000-229
Date of Issue

Conference Information
Committee SDM
Conference Date 2001/3/5(1days)
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Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Al_2O_3/Si_3N_4 buffer layer for MFIS structures
Sub Title (in English)
Keyword(1) Nitrogen radical
Keyword(2) alumina
Keyword(3) damage-free
Keyword(4) ferroelectric transistor
1st Author's Name Yoshihisa Fujisaki
1st Author's Affiliation Frontier Collaborative Research Center, Tokyo Institute of Technology()
2nd Author's Name Hiroshi Ishiwara
2nd Author's Affiliation Frontier Collaborative Research Center, Tokyo Institute of Technology
Date 2001/3/5
Paper # SDM2000-229
Volume (vol) vol.100
Number (no) 652
Page pp.pp.-
#Pages 7
Date of Issue