| Presentation | 2001/1/23 Film Characterization of Scmiconductor SiLK^* Dielectric Resin for BEOL Integration Process Y. Ida, A Oshima, J. Waeterloos, M. Mills, E. Shaffer, C. Mohler, D. Castillo, T. Stokich, P. Townsend, M. Radler, K. Foster, T. Narita, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Evaluations of Low k dielectric materials have been activated in shrinking BEOL designs. Adoption of a new material to its integration process requires popper analytical methods for film quality control. This paper describes the development of film management methods and process window evaluations of SiLK dielectric resins for integration process. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | low k / SiLK / integration / organic / SOD |
| Paper # | SDM2000-195 |
| Date of Issue |
| Conference Information | |
| Committee | SDM |
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| Conference Date | 2001/1/23(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Silicon Device and Materials (SDM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Film Characterization of Scmiconductor SiLK^* Dielectric Resin for BEOL Integration Process |
| Sub Title (in English) | |
| Keyword(1) | low k |
| Keyword(2) | SiLK |
| Keyword(3) | integration |
| Keyword(4) | organic |
| Keyword(5) | SOD |
| 1st Author's Name | Y. Ida |
| 1st Author's Affiliation | Dow Chemical Jpan Ltd.() |
| 2nd Author's Name | A Oshima |
| 2nd Author's Affiliation | Dow Chemical Jpan Ltd. |
| 3rd Author's Name | J. Waeterloos |
| 3rd Author's Affiliation | Dow Chemical Belgium |
| 4th Author's Name | M. Mills |
| 4th Author's Affiliation | Dow Chemical USA |
| 5th Author's Name | E. Shaffer |
| 5th Author's Affiliation | Dow Chemical USA |
| 6th Author's Name | C. Mohler |
| 6th Author's Affiliation | Dow Chemical USA |
| 7th Author's Name | D. Castillo |
| 7th Author's Affiliation | Dow Chemical USA |
| 8th Author's Name | T. Stokich |
| 8th Author's Affiliation | Dow Chemical USA |
| 9th Author's Name | P. Townsend |
| 9th Author's Affiliation | Dow Chemical USA |
| 10th Author's Name | M. Radler |
| 10th Author's Affiliation | Dow Chemical USA |
| 11th Author's Name | K. Foster |
| 11th Author's Affiliation | Dow Chemical USA |
| 12th Author's Name | T. Narita |
| 12th Author's Affiliation | Hitachi Chemical Co., Ltd Semiconductor Material Div. |
| Date | 2001/1/23 |
| Paper # | SDM2000-195 |
| Volume (vol) | vol.100 |
| Number (no) | 603 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |