Presentation 2001/2/21
Fabrication of PtSi Schottky Source/Drain vertical MOSFET
M. Tsutsui, T. Nagai, M. Asada,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We report on fabrication and characteristics of PtSi Schottky source/drain vertical MOSFETs. The lateral thicknesses of the Si Channel were 8nm, 20nm and 30nm, and the vertical channel length was 50nm. The on/off ration for 8nm-thick device was 250. Although the drain current at the "on" state is not large at present due to thick gate oxide, it can much improved by reducing the oxide thickness.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Schottky source/drain MOSFET / vertical transistor / PtSi/Si
Paper # ED2000-256,SDM2000-210
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Conference Information
Committee SDM
Conference Date 2001/2/21(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Fabrication of PtSi Schottky Source/Drain vertical MOSFET
Sub Title (in English)
Keyword(1) Schottky source/drain MOSFET
Keyword(2) vertical transistor
Keyword(3) PtSi/Si
1st Author's Name M. Tsutsui
1st Author's Affiliation Department of Electrical and Electronic Eng., Tokyo Institute of Technology()
2nd Author's Name T. Nagai
2nd Author's Affiliation Department of Electrical and Electronic Eng., Tokyo Institute of Technology
3rd Author's Name M. Asada
3rd Author's Affiliation Inerdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology
Date 2001/2/21
Paper # ED2000-256,SDM2000-210
Volume (vol) vol.100
Number (no) 643
Page pp.pp.-
#Pages 6
Date of Issue