Presentation 1994/11/25
A study of film structure in PECVD SiOF
Takashi Usami, Kimiaki Shimokawa, Masaki Yoshimaru,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) Water absorption and desorption processes in PECVD fluorine- doped silicon oxide(SiOF) were studied using FT-IR and TDS.In SiOF film,Si-OH bonds and hydrofluoric acid were formed by hydrolysis reaction between Si-F bonds and absorbed water.The film natural structure and essential dielectric constant of SiOF films were also studied using P-SiN capped samples in order to get rid of effects of water absorption.It was clarified that Si-OH bonds are not existed in as deposited SiOF film and Si-F bonds has unknown some states.And essential dielectric constant of SiOF film contained 14 at.% fluorine was 2.8.This low dielectric constant was achevied by keeping off water absorption and hydrolysis reaction.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) fluorine-doped silicon oxide / water absorption / film structure / low dielectric constant
Paper # SDM94-146
Date of Issue

Conference Information
Committee SDM
Conference Date 1994/11/25(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A study of film structure in PECVD SiOF
Sub Title (in English)
Keyword(1) fluorine-doped silicon oxide
Keyword(2) water absorption
Keyword(3) film structure
Keyword(4) low dielectric constant
1st Author's Name Takashi Usami
1st Author's Affiliation VLSI R&D Center,Oki electric Industry Co,Ltd.,()
2nd Author's Name Kimiaki Shimokawa
2nd Author's Affiliation VLSI R&D Center,Oki electric Industry Co,Ltd.,
3rd Author's Name Masaki Yoshimaru
3rd Author's Affiliation VLSI R&D Center,Oki electric Industry Co,Ltd.
Date 1994/11/25
Paper # SDM94-146
Volume (vol) vol.94
Number (no) 367
Page pp.pp.-
#Pages 6
Date of Issue