Presentation 1994/10/20
Low-temperature growth of Si thin films by remote plasma-enhanced CVD
Kazutoshi Utsumi, Ashtosh Ganjoo, Akira Yoshida,
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Abstract(in English) Low-temperature Si epitaxial growth is extremely important for next-generation Si ultra large scale integration(Si-ULSI)and ultra high speed devices.The remote plasma-enhanced chemical vapor deposition(RPECVD)process increases the adatom mobility on the surface of the substrate and decreases the plasma damage.In this study,we have deposited Si thin films by RPECVD with the use of 100%Si_2H_6.The crystallinity and morphology of the Si film were characterized by reflection high energy electron diffraction(RHEED),Nomarski type optical microscopy and scanning electron microscopy(SEM).Single crystalline films of Si have been obtained at 300℃.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) remote plasma-enhanced CVD / 100%Si_2H_6 / 300℃ / single crysta lline of Si film
Paper # SDM94-113
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Committee SDM
Conference Date 1994/10/20(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Low-temperature growth of Si thin films by remote plasma-enhanced CVD
Sub Title (in English)
Keyword(1) remote plasma-enhanced CVD
Keyword(2) 100%Si_2H_6
Keyword(3) 300℃
Keyword(4) single crysta lline of Si film
1st Author's Name Kazutoshi Utsumi
1st Author's Affiliation Toyohashi University of Technology()
2nd Author's Name Ashtosh Ganjoo
2nd Author's Affiliation Toyohashi University of Technology
3rd Author's Name Akira Yoshida
3rd Author's Affiliation Toyohashi University of Technology
Date 1994/10/20
Paper # SDM94-113
Volume (vol) vol.94
Number (no) 283
Page pp.pp.-
#Pages 6
Date of Issue