Presentation 1999/3/10
Gate Oxide Degradation by Charging Damage During the Contact etching
Tetsuya OHNISHI, Yoshinori HIGAMI, Atsushi KAGISAWA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) In SOI structure, the buried oxide (BOX) receives charging damage during the contact etching. The damage is increased with decreasing hole size, the buried oxide is destroyed. The evaluation of gate oxide with an antenna MOS capacitor, when the buried oxide is not destroyed, the gate oxide on SOI substrates can be superior to the gate oxide on bulk substrates. When the buried oxide is destroyed by charging damage, the destruction destroys the gate oxide.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Contact etching / S0I / Charging Damage / Gate oxide / Buried 0xide (BOX)
Paper # SDM98-218
Date of Issue

Conference Information
Committee SDM
Conference Date 1999/3/10(1days)
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Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Gate Oxide Degradation by Charging Damage During the Contact etching
Sub Title (in English)
Keyword(1) Contact etching
Keyword(2) S0I
Keyword(3) Charging Damage
Keyword(4) Gate oxide
Keyword(5) Buried 0xide (BOX)
1st Author's Name Tetsuya OHNISHI
1st Author's Affiliation Process Development Center,IC Group,SHARP Corp.()
2nd Author's Name Yoshinori HIGAMI
2nd Author's Affiliation Process Development Center,IC Group,SHARP Corp.
3rd Author's Name Atsushi KAGISAWA
3rd Author's Affiliation Process Development Center,IC Group,SHARP Corp.
Date 1999/3/10
Paper # SDM98-218
Volume (vol) vol.98
Number (no) 652
Page pp.pp.-
#Pages 5
Date of Issue