Presentation 1998/10/22
Estimation of SPICE Parameter Fluctuations using In-Line Measurements : Application to High-Speed BiCMOS Process
Yasunori Iwatsu, Seijiro Moriyama,
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Abstract(in English) We identified in-line measurement items which can monitor fluctuations of high speed BiCMOS SPICE parameters and built response surface model(RSM). Using principal component analysis(PCA), RSM was derived by Monte Carlo simulation result including calibrated process/device simulation and SPICE parameter extraction. Thus, circuit designers can obtain information of production line fluctuations more accurately.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) SPICE Parameter / Statistical Analysis / RSM / TCAD / Calibaration
Paper # VLD98-76,ED98-101,SDM98-137,ICD98-207
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Committee SDM
Conference Date 1998/10/22(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Estimation of SPICE Parameter Fluctuations using In-Line Measurements : Application to High-Speed BiCMOS Process
Sub Title (in English)
Keyword(1) SPICE Parameter
Keyword(2) Statistical Analysis
Keyword(3) RSM
Keyword(4) TCAD
Keyword(5) Calibaration
1st Author's Name Yasunori Iwatsu
1st Author's Affiliation System LSI Division, Semiconductor Group, Toshiba Corporation.()
2nd Author's Name Seijiro Moriyama
2nd Author's Affiliation System LSI Division, Semiconductor Group, Toshiba Corporation.
Date 1998/10/22
Paper # VLD98-76,ED98-101,SDM98-137,ICD98-207
Volume (vol) vol.98
Number (no) 349
Page pp.pp.-
#Pages 8
Date of Issue