Presentation 1998/8/20
Direct Nitridation of Silicon Surface at Ultra-Low-Temperature by High-Density Plasma
Katsuyuki Sekine, Yuji Saito, Masaki Hirayama, Tadahiro Ohmi,
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Abstract(in English) Direct nitridation of silicon surface can be realized at a temperature as low as 430℃ by using high-density plasma above 10^12cm^-3 featuring low ion bombardment energy below 7eV. This study results that stoichiometric silicon nitride can be obtained for the first time at a temperature of 430℃ by precise control of the nitrogen partial pressure to generate N^+_2 in plasma. Moreover, hysteresis of C-V curve attributed to charge traps in silicon nitride film can be reduced dramatically with adding hydrogen to Ar/N_2 plasma for terminating dangling bond with hydrogen.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Silicon Nitride / High-Density Plasma / Ion Bombardment / Gate Insulator
Paper # SDM98-115
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Conference Information
Committee SDM
Conference Date 1998/8/20(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Direct Nitridation of Silicon Surface at Ultra-Low-Temperature by High-Density Plasma
Sub Title (in English)
Keyword(1) Silicon Nitride
Keyword(2) High-Density Plasma
Keyword(3) Ion Bombardment
Keyword(4) Gate Insulator
1st Author's Name Katsuyuki Sekine
1st Author's Affiliation Department of Electronic Engineering, Graduate School of Engineering, Tohoku University()
2nd Author's Name Yuji Saito
2nd Author's Affiliation Department of Electronic Engineering, Graduate School of Engineering, Tohoku University
3rd Author's Name Masaki Hirayama
3rd Author's Affiliation Department of Electronic Engineering, Graduate School of Engineering, Tohoku University
4th Author's Name Tadahiro Ohmi
4th Author's Affiliation New Industry Creation Hatchery Center, Tohoku University
Date 1998/8/20
Paper # SDM98-115
Volume (vol) vol.98
Number (no) 242
Page pp.pp.-
#Pages 5
Date of Issue