Presentation 1998/12/10
Formation of Ultra-thin SiO_2 at Low Temperature by ECR Remote Plasma System
K Moriizumi, Y Ueda, T Fuyuki, H Matsunami,
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Abstract(in English) Nm-order ultra-thin SiO_2 films were formed at a low temperature of 500℃ by ECR remote plasma system. Plasma-emission spectra showed that the oxidation rate could be controlled by O_2 and Ar flow rates. The eletric properties of low-temperature SiO_2 films were evaluated by I-V and high-frequency C-V measurements. It was shown that the formation of atomic-scale preoxide before remote-plasma oxidation decreased the leakage current at low electric field down to detection-limit and that it improved Si/SiO_2 interface characteristics.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) ultra-thin SiO_2 / ECR remote plasma / low-temperature oxidation / OES / preoxide
Paper # SDM98-175
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Conference Information
Committee SDM
Conference Date 1998/12/10(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Formation of Ultra-thin SiO_2 at Low Temperature by ECR Remote Plasma System
Sub Title (in English)
Keyword(1) ultra-thin SiO_2
Keyword(2) ECR remote plasma
Keyword(3) low-temperature oxidation
Keyword(4) OES
Keyword(5) preoxide
1st Author's Name K Moriizumi
1st Author's Affiliation Department of Electronic Science and Engineering, Kyoto University()
2nd Author's Name Y Ueda
2nd Author's Affiliation Department of Electronic Scienceand Engineering, Kyoto University
3rd Author's Name T Fuyuki
3rd Author's Affiliation Graduate School of Material Science, Nara Institute of Science and Technology
4th Author's Name H Matsunami
4th Author's Affiliation Department of Electronic Scienceand Engineering, Kyoto University
Date 1998/12/10
Paper # SDM98-175
Volume (vol) vol.98
Number (no) 445
Page pp.pp.-
#Pages 6
Date of Issue