Presentation 1998/4/24
『Shallow Source/Drain Extensions for pMOSFETs with High Activation and Low Process Damage Fabricated by Plasma Doping』
Michihiko TAKASE, Kyoji YAMASHITA, Atsushi HORI, Bunji MIZUNO,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Low sheet resistance and extremely shallow profiles are achived by plasma doping with low process damage and high activation efficiency.High performance pMOSFETs have been also fabricated by taking advantage of well-controlled plasma doped extensions.Linear trans-conductance(Gm)of the pMOSFET with plasma doped extensions is about 30% larger than that of 10 keV ion implanted device with same source/drain junction depth.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) plasma doping / shallow junction / high activation / parasitic series resistance / pMOSFET / source/drain extension
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Committee SDM
Conference Date 1998/4/24(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) 『Shallow Source/Drain Extensions for pMOSFETs with High Activation and Low Process Damage Fabricated by Plasma Doping』
Sub Title (in English)
Keyword(1) plasma doping
Keyword(2) shallow junction
Keyword(3) high activation
Keyword(4) parasitic series resistance
Keyword(5) pMOSFET
Keyword(6) source/drain extension
1st Author's Name Michihiko TAKASE
1st Author's Affiliation Central Research Laboratory, Matsushita Electric Ind., Co., Ltd.()
2nd Author's Name Kyoji YAMASHITA
2nd Author's Affiliation ULSI Process Technology Development Center, Matsushita Electronics Corporation
3rd Author's Name Atsushi HORI
3rd Author's Affiliation ULSI Process Technology Development Center, Matsushita Electronics Corporation
4th Author's Name Bunji MIZUNO
4th Author's Affiliation Central Research Laboratory, Matsushita Electric Ind., Co., Ltd.
Date 1998/4/24
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Volume (vol) vol.98
Number (no) 31
Page pp.pp.-
#Pages 7
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