Presentation 1993/4/22
Organic Removal from Si Wafer Surface Using Ozonized Ultrapure Water
Shinichi Yasui, Tadahiro Ohmi, Takashi Futatsuki, Naomichi Yonekawa,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The RCA cleaning method employs H_2SO_4, H_2O_2 cleaning(SPM) to remove organic molecules.Since SPM uses chemicals and requires high temperature,however it causes problems in terms of chemical waste processing and handling.On the hand,the ozonized ultrapure water cleaning is performed at room temperature and its O_3 concentration is low.This means this method does not require chemical waste processing.Introduction of the ozonized ultrapurewater cleaning to organic material removal process will make it possible to improve handling and to realize a closed system of chemical waste processing as well as to lower process temperature in the cleaning process.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Ozone / Organic Material / Si Wafer / Surfactant / Roughness / Cleaning
Paper # SDM93-1
Date of Issue

Conference Information
Committee SDM
Conference Date 1993/4/22(1days)
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Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Organic Removal from Si Wafer Surface Using Ozonized Ultrapure Water
Sub Title (in English)
Keyword(1) Ozone
Keyword(2) Organic Material
Keyword(3) Si Wafer
Keyword(4) Surfactant
Keyword(5) Roughness
Keyword(6) Cleaning
1st Author's Name Shinichi Yasui
1st Author's Affiliation Department of Electronics Faculty of Engineering,Tohoku University()
2nd Author's Name Tadahiro Ohmi
2nd Author's Affiliation Department of Electronics Faculty of Engineering,Tohoku University
3rd Author's Name Takashi Futatsuki
3rd Author's Affiliation Department of Electronics Faculty of Engineering,Tohoku University
4th Author's Name Naomichi Yonekawa
4th Author's Affiliation Department of Electronics Faculty of Engineering,Tohoku University
Date 1993/4/22
Paper # SDM93-1
Volume (vol) vol.93
Number (no) 7
Page pp.pp.-
#Pages 8
Date of Issue