Presentation | 1993/8/24 pH Controlled chemical mechanical polishing for ultra thin bonded SOI wafers Fumitoshi Sugimoto, Hiroshi Horie, Yoshihiro Arimoto, Takashi Ito, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | A pH-cntrolled chemical mechanical polishing method has been developed for a large-area ultra-thin SOI layers with uniform thickness.Using a polishing reagent with both pH and the colloidal silica concentration lowered,as well as grooves fabricated on the SOI layer to expose the insulator oxide,polishing rate clearly dropped leaving a 0.1-μm-thick SOI layer.It is thought that the lo wer local pH of the reagent,caused by contact between the reagent and the insulator oxide,reduced the colloidal silica activity nearby the groove. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | polishing / colloidalsilica / pH / SOI |
Paper # | SDM93-84 |
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Conference Information | |
Committee | SDM |
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Conference Date | 1993/8/24(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
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Paper Information | |
Registration To | Silicon Device and Materials (SDM) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | pH Controlled chemical mechanical polishing for ultra thin bonded SOI wafers |
Sub Title (in English) | |
Keyword(1) | polishing |
Keyword(2) | colloidalsilica |
Keyword(3) | pH |
Keyword(4) | SOI |
1st Author's Name | Fumitoshi Sugimoto |
1st Author's Affiliation | ULSI Technology Laboratory,Fujitsu Laboratories Ltd.() |
2nd Author's Name | Hiroshi Horie |
2nd Author's Affiliation | ULSI Technology Laboratory,Fujitsu Laboratories Ltd. |
3rd Author's Name | Yoshihiro Arimoto |
3rd Author's Affiliation | ULSI Technology Laboratory,Fujitsu Laboratories Ltd. |
4th Author's Name | Takashi Ito |
4th Author's Affiliation | ULSI Technology Laboratory,Fujitsu Laboratories Ltd. |
Date | 1993/8/24 |
Paper # | SDM93-84 |
Volume (vol) | vol.93 |
Number (no) | 192 |
Page | pp.pp.- |
#Pages | 7 |
Date of Issue |