Presentation 1995/10/20
Low-temperature Si epitaxial growth by remote plasma-enhanced CVD
Teruaki Nishida, Kazutoshi Utsumi, Ashtosh Ganjoo, Akira Yoshida,
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Abstract(in English) Remote plasma-enhanced CVD (RPECVD) method is useful to reduce surface damage during the deposition. Hence, RPECVD is paid attention as a promising method of epitaxial growth at low temperature. In this study, we have deposited Si thin film on Si substrates by RPECVD method using RF (13.56MHz)power and 100% disilane as the source gas. Substrates were treated with HF before setting into the growth chamber, and in-situ hydrogen plasma clearing was performed. The crystallinity of the deposited Si films was characterized by RHEED. Single crystalline films of Si have been obtained without heating the substrates .
Keyword(in Japanese) (See Japanese page)
Keyword(in English) low-temperature deposition / remote plasma / Si epitaxial growth / CVD
Paper # SDM95-150
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Committee SDM
Conference Date 1995/10/20(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Low-temperature Si epitaxial growth by remote plasma-enhanced CVD
Sub Title (in English)
Keyword(1) low-temperature deposition
Keyword(2) remote plasma
Keyword(3) Si epitaxial growth
Keyword(4) CVD
1st Author's Name Teruaki Nishida
1st Author's Affiliation Toyohashi University of Technology()
2nd Author's Name Kazutoshi Utsumi
2nd Author's Affiliation Toyohashi University of Technology
3rd Author's Name Ashtosh Ganjoo
3rd Author's Affiliation Toyohashi University of Technology
4th Author's Name Akira Yoshida
4th Author's Affiliation Toyohashi University of Technology
Date 1995/10/20
Paper # SDM95-150
Volume (vol) vol.95
Number (no) 317
Page pp.pp.-
#Pages 6
Date of Issue