Presentation | 1995/10/20 Low-temperature Si epitaxial growth by remote plasma-enhanced CVD Teruaki Nishida, Kazutoshi Utsumi, Ashtosh Ganjoo, Akira Yoshida, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Remote plasma-enhanced CVD (RPECVD) method is useful to reduce surface damage during the deposition. Hence, RPECVD is paid attention as a promising method of epitaxial growth at low temperature. In this study, we have deposited Si thin film on Si substrates by RPECVD method using RF (13.56MHz)power and 100% disilane as the source gas. Substrates were treated with HF before setting into the growth chamber, and in-situ hydrogen plasma clearing was performed. The crystallinity of the deposited Si films was characterized by RHEED. Single crystalline films of Si have been obtained without heating the substrates . |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | low-temperature deposition / remote plasma / Si epitaxial growth / CVD |
Paper # | SDM95-150 |
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Committee | SDM |
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Conference Date | 1995/10/20(1days) |
Place (in Japanese) | (See Japanese page) |
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Registration To | Silicon Device and Materials (SDM) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Low-temperature Si epitaxial growth by remote plasma-enhanced CVD |
Sub Title (in English) | |
Keyword(1) | low-temperature deposition |
Keyword(2) | remote plasma |
Keyword(3) | Si epitaxial growth |
Keyword(4) | CVD |
1st Author's Name | Teruaki Nishida |
1st Author's Affiliation | Toyohashi University of Technology() |
2nd Author's Name | Kazutoshi Utsumi |
2nd Author's Affiliation | Toyohashi University of Technology |
3rd Author's Name | Ashtosh Ganjoo |
3rd Author's Affiliation | Toyohashi University of Technology |
4th Author's Name | Akira Yoshida |
4th Author's Affiliation | Toyohashi University of Technology |
Date | 1995/10/20 |
Paper # | SDM95-150 |
Volume (vol) | vol.95 |
Number (no) | 317 |
Page | pp.pp.- |
#Pages | 6 |
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