Presentation 1995/10/20
Dry development for G^b DRAM
Yasuki Kimura, Hiroyuki Endo, Akihiro Endo,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Gas composition where isotropic etching component and isotropic deposition component cancel each other, was obtained by adding ethanol gas to oxygen based chemistry. At the gas composition, resist profile was steeply rising and microloading effect of figure and etching rate was decreased. Mask facetting problem was also suppressed by decreasing rf bias without deterioration of profile. However, bowing occurs according to the pattern size down to subquater micron like G^bDRAM because directionality of ion is worse at low rf bias. The bowing problem has lwen solved by introducing material of bottom layer which includes sulfur. 4G^bDRAM class pattern has been successfully fabricated by applying these methods.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) dry development / O2RIE / multilayer resist / profile control / ethanol / ECR etcher
Paper # SDM95-145
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Conference Information
Committee SDM
Conference Date 1995/10/20(1days)
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Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Dry development for G^b DRAM
Sub Title (in English)
Keyword(1) dry development
Keyword(2) O2RIE
Keyword(3) multilayer resist
Keyword(4) profile control
Keyword(5) ethanol
Keyword(6) ECR etcher
1st Author's Name Yasuki Kimura
1st Author's Affiliation VLSI R&D center, Oki electric industry Co., Ltd.()
2nd Author's Name Hiroyuki Endo
2nd Author's Affiliation VLSI R&D center, Oki electric industry Co., Ltd.
3rd Author's Name Akihiro Endo
3rd Author's Affiliation VLSI R&D center, Oki electric industry Co., Ltd.
Date 1995/10/20
Paper # SDM95-145
Volume (vol) vol.95
Number (no) 317
Page pp.pp.-
#Pages 8
Date of Issue