Presentation 1995/5/24
Evaluation of Latent Damage in Oxide Films due to Plasma Exposure
Hiroyoshi Kitabayashi, Hirotaka Muto, Haruhisa Fujii, Shigenori Sakamori, Hiroshi Miyatake,
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Abstract(in English) Plasma process causes oxide charging, which is temporarily removed by high temparature annealing steps. However the oxide charging damage reappears during device operation as enhanced flatband voltage shift. We investigated latent damage in oxide films due to plasma exposure. It was found that latent damage depends on the polarity of FN stress. In positive FN stress (dense plasma region), neutral defects in the oxide remain after anneal. The neutral defects causes positive charge accumulation by subsequent FN stress. On the other hand, in negative FN injection, latent damage are passivated by anneal.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) MOS / Plasma exposure / FN current / Damage / SiO2
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Committee SDM
Conference Date 1995/5/24(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Evaluation of Latent Damage in Oxide Films due to Plasma Exposure
Sub Title (in English)
Keyword(1) MOS
Keyword(2) Plasma exposure
Keyword(3) FN current
Keyword(4) Damage
Keyword(5) SiO2
1st Author's Name Hiroyoshi Kitabayashi
1st Author's Affiliation Mitsubishi Electric Corp. Central Research Lab.()
2nd Author's Name Hirotaka Muto
2nd Author's Affiliation Mitsubishi Electric Corp. Central Research Lab.
3rd Author's Name Haruhisa Fujii
3rd Author's Affiliation Mitsubishi Electric Corp. Central Research Lab.
4th Author's Name Shigenori Sakamori
4th Author's Affiliation Mitsubishi Electric Corp. ULSI Lab.
5th Author's Name Hiroshi Miyatake
5th Author's Affiliation Mitsubishi Electric Corp. ULSI Lab.
Date 1995/5/24
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Volume (vol) vol.95
Number (no) 66
Page pp.pp.-
#Pages 6
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