Presentation 1996/5/23
Redistribution of in-situ doped or ion-implanted nitrogen in polysilicon and nitrogen pile-up at poly-Si/SiO_2 interface
Satoshi Nakayama, Tetushi Sakai,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) This paper reports a secondary ion mass spectroscopy analysis of the redistribution of in-situ doped or implanted nitrogen in polysilicon and the segregation of nitrogen at the polysilicon/SiO_2 interfaces during heat treatment. When nitrogen-doped polysilicon is subjected to heat treatment at temperature above 800℃, nitrogen diffuses to the poly-Si/SiO_2 interface and surface, and piles up there. Some of the nitrogen is immobile when the concentration is above a particular threshold concentration. This immobile nitrogen becomes mobile and diffuses during annealing. The threshold concentration for nitrogen diffusion depends on the grain size. There is a limit to how much nitrogen segregates to the interface. The limit depends not on the initial amount of nitrogen in the polysilicon, but only on the annealing temperature.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) polysilicon / nitrogen-doped silicon / nitrogen / diffusion / segregation
Paper # SDM96-22
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Conference Information
Committee SDM
Conference Date 1996/5/23(1days)
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Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Redistribution of in-situ doped or ion-implanted nitrogen in polysilicon and nitrogen pile-up at poly-Si/SiO_2 interface
Sub Title (in English)
Keyword(1) polysilicon
Keyword(2) nitrogen-doped silicon
Keyword(3) nitrogen
Keyword(4) diffusion
Keyword(5) segregation
1st Author's Name Satoshi Nakayama
1st Author's Affiliation NTT LSI Laboratories()
2nd Author's Name Tetushi Sakai
2nd Author's Affiliation NTT LSI Laboratories
Date 1996/5/23
Paper # SDM96-22
Volume (vol) vol.96
Number (no) 63
Page pp.pp.-
#Pages 6
Date of Issue