Presentation 1996/5/23
Tunnel Oxide Reliability Improvement by Si/SiO_2 Interface Strain Relaxation with Rapid Thermal, High Temperature Steam Oxidation
Hiroshi TOMITA, Yoshio OZAWA, Mamoru TAKAHASHI,
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Abstract(in English) Simultaneous improvement of tunnel oxide reliability, such as stress-induced leakage current, hole trap, electron trap and charge-to-breakdown (Qbd) characteristics, has been desired to achieve high performance of Flash Memories. In this paper, we propose a novel RTO (rapid thermal oxidation ) process to realize excellent tunnel oxide characteristics for the first time. Essence of the process is combination with rapid thermal, high temperature and diluted steam oxidation processes. As the results of Ols peak observations by X-ray Photoelectron Spectroscopy (XPS), mechanism of reliability improvement compared to the traditional steam oxidation process is expected to reduce weak Si-O bonds and/or imperfections of Si-O network near Si/SiO_2 interface by viscous relaxation.
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Keyword(in English) Tunnel Oxide / Interface Strain Relaxation / High Temperature Dilute Wet Oxidation
Paper # SDM96-16
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Committee SDM
Conference Date 1996/5/23(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Tunnel Oxide Reliability Improvement by Si/SiO_2 Interface Strain Relaxation with Rapid Thermal, High Temperature Steam Oxidation
Sub Title (in English)
Keyword(1) Tunnel Oxide
Keyword(2) Interface Strain Relaxation
Keyword(3) High Temperature Dilute Wet Oxidation
1st Author's Name Hiroshi TOMITA
1st Author's Affiliation Process Engineering Lab., TOSHIBA Corporation()
2nd Author's Name Yoshio OZAWA
2nd Author's Affiliation Process Engineering Lab., TOSHIBA Corporation
3rd Author's Name Mamoru TAKAHASHI
3rd Author's Affiliation Environmental Engineering Lab., TOSHIBA Corporation
Date 1996/5/23
Paper # SDM96-16
Volume (vol) vol.96
Number (no) 63
Page pp.pp.-
#Pages 8
Date of Issue