Presentation 1996/12/5
Breakdown mechanism of gate oxide
T. Tomita, H. Utsunomiya, K. Umeda, K. Taniguchi,
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Abstract(in English) We carried out substrate hot carrier injection into gate oxides with thickness of 5~10nm to investigate oxide breakdown mechanism. Hot electron injection generates substantial number of electron traps in the oxide which are caused by momentum transfer of high energy electrons to the oxide network. Quasi-oxide breakdown occurs when a chain consisting of the generated electron traps reaches from the SiO_2/substrate interface to the gate electrode. On the other hand, hot hole injection creates small defective current paths through which electron current flows. The electron current induced by hot hole injection triggers gate oxide breakdown due to Joule heating while hole current has little effect on oxide breakdown.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) silicon dioxide / oxide breakdown / substrate hot carrier injection / FN injection
Paper # SDM96-153
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Conference Information
Committee SDM
Conference Date 1996/12/5(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Breakdown mechanism of gate oxide
Sub Title (in English)
Keyword(1) silicon dioxide
Keyword(2) oxide breakdown
Keyword(3) substrate hot carrier injection
Keyword(4) FN injection
1st Author's Name T. Tomita
1st Author's Affiliation Graduate School of Engineering, Osaka University()
2nd Author's Name H. Utsunomiya
2nd Author's Affiliation Graduate School of Engineering, Osaka University
3rd Author's Name K. Umeda
3rd Author's Affiliation Central Research Laboratory, Hitachi, Ltd.
4th Author's Name K. Taniguchi
4th Author's Affiliation Graduate School of Engineering, Osaka University
Date 1996/12/5
Paper # SDM96-153
Volume (vol) vol.96
Number (no) 395
Page pp.pp.-
#Pages 9
Date of Issue