| Presentation | 1996/11/14 ULSI Manufacturing Technology toward the 21st Century Tadahiro Ohmi, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Semiconductor industry is now facing with 0.25μm ULSI volume productions by using KrF excimer laser lithography and X-ray lithography, while wafer diameter is simultaneously scheduled to be increased from 200mm to 300mm. Price of process finished wafer for highest version microprocessors is $50K to $100K for 200mm and $150K to $300K for 300mm. Thus, reliability of manufacturing technologies is strictly required in future semiconductor industry. Ultraclean process concept consisting of three principle such as 1. ultraclean wafer surface, 2. ultraclean process ambiance and 3. perfect parameter controlled process is just fitting to this requirement, resulting in an establishment of scientific semiconductor manufacturing where mechanisms of all processings are made clean in an academic manner and process equipment is designed and installed under this academic understanding to all processes. High throughput and low cost ULSI production with 100% yield becomes available under these researches and development. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | epi-wafer / microroughness / chromium oxide passivation / total room temperature wet cleaning / closed manufacturing |
| Paper # | SDM96-124 |
| Date of Issue |
| Conference Information | |
| Committee | SDM |
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| Conference Date | 1996/11/14(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Silicon Device and Materials (SDM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | ULSI Manufacturing Technology toward the 21st Century |
| Sub Title (in English) | |
| Keyword(1) | epi-wafer |
| Keyword(2) | microroughness |
| Keyword(3) | chromium oxide passivation |
| Keyword(4) | total room temperature wet cleaning |
| Keyword(5) | closed manufacturing |
| 1st Author's Name | Tadahiro Ohmi |
| 1st Author's Affiliation | Department of Electronics, Faculty of Engineering, Tohoku University() |
| Date | 1996/11/14 |
| Paper # | SDM96-124 |
| Volume (vol) | vol.96 |
| Number (no) | 359 |
| Page | pp.pp.- |
| #Pages | 11 |
| Date of Issue | |