Presentation 1997/3/13
Anneahng Effect on Resistivity of Germanium Ion Implanted Polycrystalline Silicon Films
Keiji Wada, Hiroshi Ydmamoto, Hiroshi Kuwano,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Solid-phase-recrystallized poly-Si films by Ge ion implantation have larger grain size than those by Si ion implantation. The pn-diodes fabricated in Ge implanted poly-Si films have lower leakage current and higher on/off current ratio than those in Si implanted poly-Si films. It is found that the resistivity in the non doped and low doped films is drastically decreased after annealing at temperature above 950℃, and that the conductivity is changed into n-type from p-type. These phenomena occur remarkably with increasing doses of Ge. A few experiments are carried out to investigate the cause of these phenomena.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Ge ion implantation / Poly-Si / Solid-phase recrystallization / Anneal / Non dope
Paper # SDM96-226
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Committee SDM
Conference Date 1997/3/13(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Anneahng Effect on Resistivity of Germanium Ion Implanted Polycrystalline Silicon Films
Sub Title (in English)
Keyword(1) Ge ion implantation
Keyword(2) Poly-Si
Keyword(3) Solid-phase recrystallization
Keyword(4) Anneal
Keyword(5) Non dope
1st Author's Name Keiji Wada
1st Author's Affiliation Faculty of Science & Technology, Keio University()
2nd Author's Name Hiroshi Ydmamoto
2nd Author's Affiliation Faculty of Science & Technology, Keio University
3rd Author's Name Hiroshi Kuwano
3rd Author's Affiliation Faculty of Science & Technology, Keio University
Date 1997/3/13
Paper # SDM96-226
Volume (vol) vol.96
Number (no) 570
Page pp.pp.-
#Pages 8
Date of Issue