Presentation 1998/1/23
Highly Reliable SiOF Film Formation by HDP-CVD Using Fluorosilanes
T. Fukuda, T. Hosokawa, E. Sasaki, N. Kobayashi,
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Abstract(in English) Highly stable SiOF films that have a low ε and fewer O-H bonds and higher permeability tolerance than P-TEOS are formed using a conventional apparatus. Films were produced using processes that generate hydrogen species. One, a SiF_2H_2 process which generates a very stable precursor, SiF_2, produces very stable SiOF with ε=3.3. The other, amixing process of SiF_4 and SiH_4, gives very stable SiOF (ε=3.6) at a low cost. Both processes were successfully applied to the intermetal dielectrics of a 0.35mm device without causing electrical degradation in the MOS characteristics.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) CVD / SiOF / low-k / SiF_2H_2 / SiF_4 / hygroscopy / permeability
Paper # SDM97-180
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Conference Information
Committee SDM
Conference Date 1998/1/23(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Highly Reliable SiOF Film Formation by HDP-CVD Using Fluorosilanes
Sub Title (in English)
Keyword(1) CVD
Keyword(2) SiOF
Keyword(3) low-k
Keyword(4) SiF_2H_2
Keyword(5) SiF_4
Keyword(6) hygroscopy
Keyword(7) permeability
1st Author's Name T. Fukuda
1st Author's Affiliation Semiconductor Technology Development Center, Semiconductor & Integrated Circuits Div., Hitachi Ltd.()
2nd Author's Name T. Hosokawa
2nd Author's Affiliation Semiconductor Technology Development Center, Semiconductor & Integrated Circuits Div., Hitachi Ltd.
3rd Author's Name E. Sasaki
3rd Author's Affiliation Hitachi ULSI Engineering Corporation
4th Author's Name N. Kobayashi
4th Author's Affiliation Semiconductor Technology Development Center, Semiconductor & Integrated Circuits Div., Hitachi Ltd.
Date 1998/1/23
Paper # SDM97-180
Volume (vol) vol.97
Number (no) 508
Page pp.pp.-
#Pages 7
Date of Issue