| Presentation | 1997/7/24 Characteristics of MOCVD-Cu Films Using Direct Liquid Injection and the Effects of Post-annealing Chi-Hoon Jun, Youn Tae Kim, Jong Tae Baek, Hyung Joun Yoo, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Copper metalorganic chemical vapor deposition (MOCVD) using a direct liquid injection system for the (hfac)Cu(VTMOS) [1,1,1,5,5,5-hexafluoro-2, 4-pentadionato(vinyltrimethoxysilane)copper(I)] precursor, has been performed onto TiN, p-type <100> Si, and Si_3N_4 substrates. The influences of reaction temperature and the substrate type on the growth rate, the microstructure, and the electrical resistivity of the copper film have been discussed. To clarify the effects of post-annealing on the characteristics of MOCVD-Cu films, rapid thermal processing (RTP) of Cu/TiN/Si structures has been explored. The electrical and the microstructural characteristics of Cu on reactive sputtered TiN have been studied by observing the changes before and after RTP treatment. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Cu MOCVD / direct liquid injection / (hfac)Cu(VTMOS) precursor / post-annealing / RTP |
| Paper # | SDM97-49 |
| Date of Issue |
| Conference Information | |
| Committee | SDM |
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| Conference Date | 1997/7/24(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Silicon Device and Materials (SDM) |
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| Language | ENG |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Characteristics of MOCVD-Cu Films Using Direct Liquid Injection and the Effects of Post-annealing |
| Sub Title (in English) | |
| Keyword(1) | Cu MOCVD |
| Keyword(2) | direct liquid injection |
| Keyword(3) | (hfac)Cu(VTMOS) precursor |
| Keyword(4) | post-annealing |
| Keyword(5) | RTP |
| 1st Author's Name | Chi-Hoon Jun |
| 1st Author's Affiliation | Semiconductor Technology Division, ETRI() |
| 2nd Author's Name | Youn Tae Kim |
| 2nd Author's Affiliation | Semiconductor Technology Division, ETRI |
| 3rd Author's Name | Jong Tae Baek |
| 3rd Author's Affiliation | Semiconductor Technology Division, ETRI |
| 4th Author's Name | Hyung Joun Yoo |
| 4th Author's Affiliation | Semiconductor Technology Division, ETRI |
| Date | 1997/7/24 |
| Paper # | SDM97-49 |
| Volume (vol) | vol.97 |
| Number (no) | 195 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |