Presentation 1997/7/24
Analysis of Dopant Interdiffusion and Parasitics Reduction on a-Si/Ti Local Wiring Scheme
Jiro Ida, Atsushi Ohtomo, Kouichi Morikawa, Hiroshi Onoda,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The a-Si/Ti local wiring technology is characterized from the viewpoints of dopant interdiffusion behavior and parasitics reduction. It was founded that only p+/njunction degrades with the TiSi2 local wiring connecting n+layer and p+layer. The results of electrical measurement with a set of new test patterns suggest the reason, that is, the boron dose not diffuse from TiSi_2 to Sidue to high efficiency of TiB formation. The effect of parasitics reduction on the practical circuit of the 54bit x 2K dual-port SRAM macro was comparatively analyzed with and without TiSi2 local wiring scheme. The area reduction of 31% and the total power reduction of 15.2% was obtained. It was emphasized the reduction of junction capacitance with the local wiring scheme is beneficial to low voltage / low power circuit applications in sub half micron CMOS.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) TiSi2 / local wiring / salicide / SRAM
Paper # SDM97-45
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Conference Information
Committee SDM
Conference Date 1997/7/24(1days)
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Paper Information
Registration To Silicon Device and Materials (SDM)
Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Analysis of Dopant Interdiffusion and Parasitics Reduction on a-Si/Ti Local Wiring Scheme
Sub Title (in English)
Keyword(1) TiSi2
Keyword(2) local wiring
Keyword(3) salicide
Keyword(4) SRAM
1st Author's Name Jiro Ida
1st Author's Affiliation VLSI R&D Center, OKI Electric Industry Co., Ltd.()
2nd Author's Name Atsushi Ohtomo
2nd Author's Affiliation VLSI R&D Center, OKI Electric Industry Co., Ltd.
3rd Author's Name Kouichi Morikawa
3rd Author's Affiliation VLSI R&D Center, OKI Electric Industry Co., Ltd.
4th Author's Name Hiroshi Onoda
4th Author's Affiliation VLSI R&D Center, OKI Electric Industry Co., Ltd.
Date 1997/7/24
Paper # SDM97-45
Volume (vol) vol.97
Number (no) 195
Page pp.pp.-
#Pages 6
Date of Issue