Presentation 1995/6/23
A study of the leakage effect on the earphone response measurement using the narrow slit approximation.
Satoru Noge, Masaki Okada, Shokichiro Yoshikawa,
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Abstract(in English) The leakage effect, earphone response measurement using the ear simulator standardized by IEC (International Erectrotechnical Commission), becomes a difficult problem. This report described the narrow slit approximation method to treat the leakage effect quantitatively at an earphone measurement. A sound pressure level change which fitted a earphone to a real ear is reproduced the narrow slit approximation method using the newly leakage adaptor and the IEC711 ear simulator. This measurement method using a leakage adaptor is very flexible and simple, so the leakage effect is defined giometicaly scale and the leakage parameter changing continuously and smoothly. This narrow slit approximation method that leakage adaptor defined parameter is successful for an equivalent circuit analysis of an earphone response.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) earphone / ear simulator / leakage effect / narrow slit / response
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Committee EA
Conference Date 1995/6/23(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A study of the leakage effect on the earphone response measurement using the narrow slit approximation.
Sub Title (in English)
Keyword(1) earphone
Keyword(2) ear simulator
Keyword(3) leakage effect
Keyword(4) narrow slit
Keyword(5) response
1st Author's Name Satoru Noge
1st Author's Affiliation Dept. of Electrical and Electronic Engineering KANAGAWA Institute of Technology()
2nd Author's Name Masaki Okada
2nd Author's Affiliation Dept. of Electrical and Electronic Engineering KANAGAWA Institute of Technology
3rd Author's Name Shokichiro Yoshikawa
3rd Author's Affiliation Dept. of Electrical and Electronic Engineering KANAGAWA Institute of Technology
Date 1995/6/23
Paper #
Volume (vol) vol.95
Number (no) 128
Page pp.pp.-
#Pages 6
Date of Issue